Top 10 Semiconductor Stocks To Invest In 2014

Ever seen a semiconductor company make an ad to air during movie previews? That's what Qualcomm (NASDAQ: QCOM  ) did with its latest�Snapdragon microprocessor, which had already made a splash at this year's Consumer Electronics Show in January. While that kind of grand gesture can be a risky move, it looks like it might have played out in Qualcomm's favor.

Since then, Qualcomm has seen some impressive sales, and managed to bulk up its financial stats as well. Motley Fool contributor Caroline Bennett analyzes some of Qualcomm's top strengths in the video below, and sheds some light on why this company might be a good pick for your portfolio.

It's incredible to think just how much of our digital and technological lives are almost entirely shaped and molded by just a handful of companies. Find out "Who Will Win the War Between the 5 Biggest Tech Stocks?" in The Motley Fool's latest free report, which details the knock-down, drag-out battle being waged by the five kings of tech. Click here to keep reading.

5 Best Beverage Stocks To Buy For 2015: ARM Holdings PLC (ARMH)

ARM Holdings plc (ARM), incorporated on October 16, 1990, designs microprocessors, physical intellectual property (IP) and related technology and software, and sells development tools. As of December 31, 2012, the Company operated in three business segments: the Processor Division (PD), the Physical IP Division (PIPD) and the System Design Division (SDD). ARM licenses and sells its technology and products to international electronics companies, which in turn manufacture, markets and sells microprocessors, application-specific integrated circuits (ASICs) and application-specific standard processors (ASSPs) based on ARM�� technology to systems companies for incorporation into a range of end products. It also licenses and sells development tools directly to systems companies and provides support services to its licensees, systems companies and other systems designers.

ARM processor architecture and physical IP is used in embedded microprocessor applications, including cellular phones, digital televisions, mobile computers and personal computer peripherals, smart cards and microcontrollers. ARM�� principal geographic markets are Europe, the United States and Asia Pacific. ARM�� product offering includes microprocessor Cores: RISC microprocessor cores, including specific functions, such as video and graphics IP and on-chip fabric IP; embedded software; physical IP; development tools, and support and maintenance services.

Processor Division

The PD encompasses those resources that are centered on microprocessor cores, including specific functions, such as graphics IP, fabric IP, embedded software IP and configurable digital signal processing (DSP) IP. Service revenues consist of design consulting services and revenues from support, maintenance and training.

Physical IP Division

The PIPD is focused on building blocks for translation of a circuit design into actual silicon. During the year ended December 31, 2012, the Company�� total av! erage PIPD headcount was 557. ARM is a provider of physical IP components for the design and manufacture of integrated circuits, including systems-on-chip (SoCs). ARM Artisan physical IP products include embedded memory, standard cell and input/output components. Artisan physical IP also includes a limited portfolio of analog and mixed-signal products. ARM�� physical IP components are developed for a range of process geometries ranging from 20 nanometer - 250 nanometer. ARM licenses its products to customers for the design and manufacture of integrated circuits used in complex, high-volume applications, such as portable computing devices, communication systems, cellular phones, microcontrollers, consumer multimedia products, automotive electronics, personal computers and workstations and many others.

ARM�� embedded memory components include random access memories, read only memories and register files. These memories are provided in the form of a configurable memory compiler, which allows the customer to generate the appropriate configuration for the given application. ARM�� memory components include many configurable features, such as power-down modes, low-voltage data retention and fully static operation, as well as different transistor options to trade off performance and power. In addition, ARM�� memory components include built-in test interfaces that support the industry test methodologies and tools. ARM memory components also offer redundant storage elements.

ARM�� memory components are designed to enable the chip designer maximum flexibility to achieve the optimum power, performance, and density trade-off. ARM offers standard cell components that are optimized for high performance, high density or ultra high density. ARM logic products deliver optimal performance, power and area when building ARM Processors, Graphics, Video and Fabric IP along with general SoC subsystem implementation. ARM delivers physical interface for a range of DDR SDRAM (double-data rate s! ynchronou! s dynamic random-access memory) applications ranging from mission critical applications to low-power memory sub-systems. Silicon on Insulator (SOI) products is an alternative methodology to traditional semiconductor fabrication techniques.

System Design Division

The SDD is focused on the tools and models used to create and debug software and system-on-chip (SoC) designs. ARM�� software development tools help a software design engineer deliver products right the first time. Engineers use these tools in the design and deployment of code, from applications running on open operating systems right through to low-level firmware. The ARM Development Studio is a hardware components that allow the software designer to connect to a real target system and control the system for the purposes of finding errors in the software. The ARM DSTREAM unit allows the software developer to control the software running on the prototype product and examine the internal state of the prototype product. ARM Development Boards are ideal systems for prototyping ARM-based products. The ARM Microcontroller Development Kit supports ARM-based microcontrollers and 8051-based microcontrollers from companies, such as Analog Devices, Atmel, Freescale, Fujitsu, NXP, Samsung, Sharp, STMicroelectronics, Texas Instruments and Toshiba. The ARM Microcontroller Development Kit is used by developers who are building products and writing software using standard off-the-shelf microcontrollers.

The ARM Microprocessor Families

ARM architecture processors offers a range of performance options in the ARM7 family, ARM9 family, ARM11 family, ARM Cortex family and ARM SecurCore family. The ARM architecture gives systems designers a choice of processor cores at different performance/price points. The ARM7 offers 32-bit architecture capable of operating from 8/16-bit memory on an 8/16-bit bus through the implementation of the Thumb instruction set. The ARM9 family consists of a range of microprocessors in ! the 150-2! 50MHz range. Each processor has been designed for a specific application or function, such as an application processor for a feature phone or running a wireless fidelity (WiFi) protocol stack. The ARM9 family consists of a range of microprocessors in the 150-250 megahertz range. The ARM11 family consists of a range of microprocessors in the 300-600 megahertz range. ARM Cortex family is ARM�� family of processor cores based on version 7 of the ARM Architecture. The family is split into three series: A Series, A Series and M Series.

Advisors' Opinion:

• [By David O��ara]

  ARM Holdings (LSE: ARM  ) (NASDAQ: ARMH  )
  ARM Holdings designs the microprocessors that have become first choice among mobile-phone and tablet manufacturers. The mobile-device boom has produced a share price boom at the company. City analysts expect high earnings growth to continue. A 73% rise in earnings per share is forecast for 2013, to be followed by another 26% rise in 2014. Dividends are also expected to continue their sharp increases, rising by nearly 25% this year and next.

Top 10 Semiconductor Stocks To Invest In 2014: GigOptix Inc (GIG)

GigOptix, Inc. (GigOptix), incorporated on March 2008, is a supplier of semiconductor and electro-optical component products that enables high-speed end to end data streaming over optical fiber and wireless telecommunications and data-communications networks globally. The Company's products convert signals between electrical and optical formats for transmitting and receiving data over fiber optic networks and between electrical and high speed radio frequencies to enable the transmission and receipt of data over wireless networks. The Company is creating both optical telecommunications and data-communications applications for fast growing markets in 10 giga bytes per second (Gbps), 40Gbps and 100Gbps drivers, receiver integrated circuits (IC), electro-optic modulator components and multi-chip-modules (MCM), as well as E-band wireless data-communications applications for high speed mobile backhaul and other high capacity wireless data transport applications. During the year ended December 31, 2011, the Company shipped over 150 products to over 200 customers.

The Company offers a portfolio of 10Gbps and 40Gbps electro-optical products and is developing market for 100Gbps products. The Company provides bundled solutions that consist of a few of its products, such as modulator and driver. The Company also offers a comprehensive portfolio of Monolithic Microwave Integrated Circuit (MMIC) and application-specific integrated circuit (ASIC) products to support E-band wireless communication and defense markets. The Company has also developed 10Gbps vertical cavity surface-emitting laser (VCSEL) drivers and receivers for aerospace as well as outdoor, non-temperature controlled environments that enables higher capacity in its customers' next generation flight and data center systems.

The Company has a portfolio of products for telecommunications , data-communications, defenses and industrial applications designed for optical speeds from 3Gbps to over 100Gbps and for wireless frequencies! from zero giga hertz (GHz) to 86GHz. The Company's products support a range of data rates, protocols, transmission distances and industry standards.

The Company's portfolio consists of the product ranges, such as laser and modulator drivers for 10Gbps, 40Gbps and 100Gbps applications; receiver amplifiers or Trans-impedance Amplifiers (TIAs) for 10Gbps, 40Gbps and 100Gbps applications; VCSEL driver and receiver chipsets for 14 and 12 channel parallel optics applications from 3Gbps to 10Gbps; Electro-optic modulators based on the Company's TFPS technology suitable for various 40Gbps and 100Gbps modulation schemes, such as differential phase shift keying (DPSK), differential quadrature phase shift keying (DQPSK), RZ-DQPSK and DP-QPSK; wideband monolithic microwave integrated circuit (MMIC) amplifiers with flat gain response; high frequency MMIC Power Amplifiers with high gain and output power; high frequency passive attenuators and filters in small form factors, and standard cell, and structured ASIC and hybrid ASIC designs and manufacturing service for multiple markets offering information technology acquisition review (ITAR) compliance for defense applications. The Company designs and market products that amplifies electrical signals during both the transmission (amplifiers and optical drivers) and reception (TIAs) of optical signals as well as modulate optical signals in the transmission of data.

The Company's optical drivers amplify the input digital data stream that is used to modulate laser light either by direct modulation of the laser or by use of an external modulator that acts as a precise shutter to switch on and off light to create the optical data stream. The Company supplies an optimized component for each type of laser, modulator and photo-diode depending upon the speed, reach and required cost. The Company's microwave and millimeter wave amplifiers amplify small signal radio signals into more signals that can be transmitted over long distances to establish high t! hroughput! data connections or enable radar based applications. The Company's ASIC solutions are used in a number of applications such as defense and test and measurement applications to enable the high speed processing of complex signals.

The Company's product portfolio is designed to cover the range of solutions needed in these different modules. The Company's product portfolio consists of five product lines: GX Series, which includes serial drivers and TIA ICs devices for telecom and data-com markets; HX Series, which includes multi-channel driver and TIA ICs for short reach data-com and optical interconnect applications; LX Series, which includes TFPS modulators for high speed telecom and defense applications; EX Series, which includes amplifiers, filters and attenuators for microwave applications in defense and instrumentation, and CX Series, which includes family of ASIC solutions for custom integrated circuit design.

GX Series

The GigOptix GX Series of products services both the telecom and data-com markets with a broad portfolio of drivers and transimpedence amplifiers that address 10Gbps, 40Gbps and 100Gbps speeds over distances that range from 100 meters to 10,000 kilometers. The GX Series devices are used in FiberChannel, Ethernet, synchronous optical networking (SONET)/ synchronous digital hierarchy (SDH) components and those based upon the optical internetworking forum (OIF) standards.

HX Series

The GigOptix HX Series of products service the high performance computing (HPC), data-com and consumer markets with a portfolio of parallel VCSEL drivers and TIAs that address 3Gbps, 5Gbps,10Gbps, 14Gbps, 16Gbps and 25Gbps channel speeds over 100-300 meters distances in four and 12 channel configurations. The HX Series devices are used in HPC formats, Infiniband, Ethernet and optical high definition multimedia interface (HDMI) components.

LX Series

The GigOptix LX Series of products service the 40Gbps and above telecom! market f! or Mach-Zehnder modulators. The LX Series devices are based on the Company's TFPS EO material technology.

EX Series

The GigOptix EX Series of products leverages the high performance products acquired in the Endwave acquisition. In addition, it also includes the die and design techniques developed for the GX Series telecom and data-com drivers for related defense and instrumentation applications.

CX Series

The GigOptix CX Series of products offers a portfolio of distinct paths to digital and analog mixed signal ASICs with the capability of supporting designs of up to 10M gates in technologies ranging from 0.6 through 65nm. The CX Series uses the Company's technology in Structured and Hybrid ASICs to enable a generic ASIC solution that can be customized for a customer using only a few metal mask layers. The CX Series also offers ASIC services, including Analog and Mixed Signal IP into designs and taking customers designs from RTL or gate-level net list definitions to volume production with third party foundries.

The Company competes with TriQuint, Rohm, InPhi, Centellax, Semtech, Vitesse, M/A-Com, Avago, Emcore, Tyco Electronics, IPtronics. Avago, Emcore, Tyco Electronics, JDSU, Oclaro, Sumitomo, Fujitsu, Emcore, Oclaro, Hittite, Sumitomo, Hittite, RFMD, Northrop Grumman, On -Semiconductor, eSilicon, Open Silicon, Faraday, Toshiba and eASIC.

Advisors' Opinion:

• [By Bryan Murphy]

  It's admittedly overbought and due for a slight dip thanks to today's surge. But when you take a step back and look at GigOptix Inc. (NYSEMKT:GIG), there's actually a lot to be excited about if you've been mulling a trading in GIG. The trick will be getting the timing right.

Top 10 Semiconductor Stocks To Invest In 2014: Ambarella Inc (AMBA)

Ambarella, Inc., incorporated on January 15, 2004, is a developer of semiconductor processing solutions for video that enable high-definition (HD), video capture, sharing and display. The Company combine its processor design capabilities with its video and image processing, algorithms and software to provide a technology platform. It sells solutions into the camera and infrastructure markets, with approximately 27 million system-on-a-chips (SoCs) shipped since our inception. In the camera market, its solutions enable the creation of video content for wearable sports cameras, automotive aftermarket cameras, Internet Protocol (IP), security cameras, digital still cameras (DSCs), telepresence cameras, camcorders and pocket video cameras. In the infrastructure market, its solutions manage IP video traffic, broadcast encoding and IP video delivery applications. In 2012, the Company released its Wireless Camera Developers Kit. In 2012, it also launched S2 SoC, which enables Ultra High-Definition IP security cameras.

The Company sells its solutions to original design manufacturers (ODMs), and original equipment manufacturers (OEMs), globally. In the camera market, its video processing solutions are designed into products from OEMs, including Robert Bosch GmbH and affiliated entities, Samsung Electronics Co., Ltd. and Woodman Labs, Inc., doing business as (d/b/a) GoPro, or GoPro, who source its solutions from ODMs, including Ability Enterprise Co., Ltd., Asia Optical Co. Inc., Chicony Electronics Co., Ltd., DXG Technology Corp., Hon Hai Precision Industry Co., Ltd. and Sky Light Digital Ltd. In the infrastructure market, its solutions are designed into products from OEMs, including Harmonic Inc., Motorola Mobility, Inc. (owned by Google, Inc.) and Telefonaktiebolaget LM Ericsson, who source its solutions from ODMs, such as Plexus Corp.

AmbaClear

The Company�� image signal processing architecture, known as AmbaClear, incorporates advanced algorithms to convert raw senso! r data to high-resolution still and high-definition video images concurrently. Image processing algorithms include sensor, lens and color correction, demosaicing, which is a process used to reconstruct a full color image from incomplete color samples, noise filtering, detail enhancement and image format conversion.

AmbaCast

The Company�� HD video processing architecture, known as AmbaCast, incorporates advanced algorithms for motion estimation, motion-compensated temporal filtering, mode decision and rate control. It supports all three compression profilesbaseline, main and highas specified in the H.264 standard. Its solutions for the broadcast infrastructure market allow OEMs to offer both the H.264 and MPEG-2 encoding formats.

Design Methodology

The Company test and verify its algorithms on its architectural model prior to implementing algorithms in hardware. Its advanced verification methodology validates its approach through simultaneous modeling of architecture, algorithms and the hardware itself.

SoC Solution

The Company�� SoC designs integrate HD video processing, image processing, applications processing and system functions onto a single chip, delivering video and image quality with features, including advanced wireless connectivity. In addition, its SoCs integrate mixed signal (analog/digital) functionality and high speed interfaces required for interfacing to advanced high-speed CMOS sensors and industry standard interfaces, such as USB 2.0 and HDMI 1.4. Its A7L SoC, which it introduced in September 2011, is fabricated in edge 32 nanometer (nm) process technology and integrates AmbaClear and AmbaCast technology.

Software Development Kit for Connectivity

The Company�� video streaming technology enables the camera�� image to be previewed on a smartphone. To enable this functionality, end customers deploy its Wireless Camera Developer�� Kit, or the Kit, which enables the design of ca! meras tha! t combine still photography and Full HD video with wireless video streaming to smartphones. The Kit is available for its A7L SoC product family, providing full 1080p60 HD video with photography and low power consumption.

The Company competes with CSR Plc, Fujitsu Limited, HiSilicon Technologies Co., Ltd., Texas Instruments Incorporated, Canon Inc., Panasonic Corporation, Sony Corporation, Novatek Microelectronics Corp., Sunplus Technology Co. Ltd., Intel Corporation, Magnum Semiconductor, Inc., Texas Instruments Incorporated, Broadcom Corporation, NVIDIA Corporation, Qualcomm Incorporated and Samsung.

Advisors' Opinion:

• [By Rick Munarriz]

  I've suggested that investors buy Ambarella (NASDAQ: AMBA  ) instead of GoPro. It's the lone provider of�video compression and image processing semiconductors for GoPro's cameras, but Ambarella isn't hogtied to GoPro's popularity. Ambarella's presence in Dropcam surveillance cameras and a recent deal for Google Helpouts provide diversification in high-def cameras.�

• [By amal.singh70]

  Ambarella (AMBA) is riding the growth of the increasing application of cameras in various applications. The company expects solid growth for its high-definition camera segment in the second half of the year as the consumer continued to appreciate the benefits of hands-free cameras with great video quality and the wireless connectivity.

• [By Monica Gerson]

  Ambarella (NASDAQ: AMBA) is estimated to post its Q2 earnings at $0.28 per share on revenue of $44.67 million.

  Shiloh Industries (NASDAQ: SHLO) is projected to report its Q3 earnings.

• [By MONEYMORNING]

  Of course I'm talking about wearable tech. And Ambarella Inc. (Nasdaq: AMBA).

  Thanks to its extreme-sports "helmet cams," Ambarella is a leader in the wearable-technology category. And the company's stock has more than doubled since we first talked about it back in August.

Top 10 Semiconductor Stocks To Invest In 2014: NeoPhotonics Corp (NPTN)

NeoPhotonics Corporation, incorporated on October 31, 1996, is a designer and manufacturer of photonic integrated circuit (PIC)-based modules and subsystems for bandwidth-intensive, high-speed communications networks. The Company has a portfolio of over 300 products, including products that enable data transmission at 10 gigabytes per second, 40 gigabytes per second and 100 gigabytes per second, agility products, such as reconfigurable optical add/drop multiplexers (ROADMs) that allocate bandwidth to adjust for volatile traffic patterns, and access products that provide high-bandwidth connections to more devices and people over fixed and wireless networks. In October 2011, the Company acquired Santur Corporation. In June 2013, it announced first shipments of optical transceiver modules out of its new, high capacity factory in Dongguan, Guangdong Province, China.

The Company�� products are categorized in 34 product families. The Company sells its products to the network equipment vendors globally, including ADVA AG Optical Networking Ltd., Alcatel-Lucent SA, Ciena Corporation (including its recent acquisition of Nortel�� Metro Ethernet Networks business), Cisco Systems, Inc., FiberHome Technologies Group, ECI Telecom Ltd., Telefonaktiebolaget LM Ericsson, Fujitsu Limited, Harmonic, Inc., Huawei Technologies Co., Ltd., Mitsubishi Electric Corporation, NEC Corporation, Nokia Siemens Networks B.V. and ZTE Corporation.

The Company competes with Finisar Corporation, JDS Uniphase Corporation, MRV Communications, Inc., NTT Electronics Corporation and Sumitomo Electric Device Innovations, Inc.

Advisors' Opinion:

• [By Anders Bylund]

  Close competitor NeoPhotonics (NYSE: NPTN  ) soared 15% higher. Larger rival JDS Uniphase (NASDAQ: JDSU  ) jumped 7.9% to become the fastest gainer on the S&P 500. If Ciena can beat its own expectations in selling Internet backbone equipment to a bevy of major telecoms, its chief rivals must eventually follow suit. JDS is only one month removed from its latest quarterly report, which sent shares diving 7% overnight (but all was forgiven a week later). NeoPhotonics also reported in early May, but didn't make any waves then.

Top 10 Semiconductor Stocks To Invest In 2014: Advanced Semiconductor Engineering Inc (ASX)

Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.

The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.

Packaging Services

The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).

The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.

The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.

Testing Services

The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.

The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.

Advisors' Opinion:

• [By Alexis Xydias]

  The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.

• [By Seth Jayson]

  Advanced Semiconductor Engineering (NYSE: ASX  ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:

• [By Adam Haigh]

  ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.

Top 10 Semiconductor Stocks To Invest In 2014: Solitron Devices Inc (SODI)

Solitron Devices, Inc., incorporated on March 12, 1987, designs, develops, manufactures and markets solid-state semiconductor components and related devices primarily for the military and aerospace markets. The Company manufactures a variety of bipolar and metal oxide semiconductor (MOS) power transistors, power and controls hybrids, junction and power MOS field effect transistors (Power MOSFETS), field effect transistors and other related products. It's products are custom made pursuant to contracts with customers whose end products are sold to the United States government. The Company�� semiconductor products can be classified as active electronic components. The Company�� active electronic components include bipolar transistors and MOS transistors.

The Company�� semiconductor products are used as components of military, commercial, and aerospace electronic equipment, such as ground and airborne radar systems, power distribution systems, missiles, missile control systems, and spacecraft. Its products have been used on the space shuttle and on the spacecraft sent to the moon, to Jupiter (on Galileo) and, to Mars (on Global Surveyor and Mars Sojourner).

Power Transistors

The Company manufactures a variety of power bipolar transistors for applications requiring currents in the range of 0.1 ampere to 300 ampere or voltages in the range of 30 volts to 1000 volts. It also manufactures power diodes under the same military specification. In addition, it manufactures power N-Channel and P-Channel MOSFET transistors and is expanding that line in accordance with customers��requirements.

Hybrids

The Company manufactures thick film hybrids, which generally contain discrete semiconductor chips, integrated circuits, chip capacitors and thick film or thin film resistors. The hybrids are of the high-power type and are custom manufactured for military and aerospace systems. Some of the Company�� hybrids include high power voltage regulators, p! ower amplifiers, power drivers, boosters and controllers. The Company manufactures both standard and custom hybrids.

Voltage Regulators

Voltage regulators provide the power required to activate electronic components such as the integrated circuits. These circuits are found in all electronic devices from radar and missile systems to smart phones.

Field Effect Transistors

The Company manufactures about 30 different types of junction and MOS field effect transistor chips. They are used to produce over 350 different field effect transistor types. The Company�� field effect transistors conform to standard Joint Electronic Device Engineering Council designated transistors, commonly referred to as standard 2N number types. It manufactures both standard and custom field effect transistors.

The Competes with IXYS Corporation, Motorola Inc., International Rectifier, Microsemi Corporation, M.S. Kennedy Corporation, Natel Engineering Company and Sensitron Semiconductor.

Advisors' Opinion:

• [By Geoff Gannon] strong>OPT-Sciences (OPST)

  Micropac

  Micropac is 76% owned by Heinz-Werner Hempel. He�� a German businessman. You can see the German company he founded here. He�� had control of Micropac for a long-time. I don�� have an exact number in front of me. But I would guess it�� been something like 25 years.

  ADDvantage

  ADDvantage Technologies is controlled by the Chymiak brothers. See the company�� April 4 press release explaining their decision to turn over the CEO position to an outsider. Regardless, the Chymiaks still control 47% of the company. Ken Chymiak is now chairman. And David Chymiak is still a director and now the company�� chief technology officer. Clearly, it�� still their company.

  By the way, the name ADDvantage Technologies has nothing to do with the Chymiaks. Today�� AEY really traces its roots to a private company called Tulsat. The Chymiak brothers acquired that company about 27 years ago. So, effectively, when you buy shares of AEY you are buying into a 27-year-old family-controlled company.

  That�� pretty typical in the world of net-nets.

  Solitron

  Solitron Devices is 29% owned by Shevach Saraf. He has been the CEO for 20 years. The post-bankruptcy Solitron has never known another CEO. Before the bankruptcy, Solitron was a much bigger, much different company. So even though we are not talking about the founder here ��and even though 70% of the company�� shares are not held by the CEO ��we��e still talking about a company where one person has a lot of control. Solitron only has three directors. Saraf is the chairman, CEO, president, CFO and treasurer. Neither of the other two directors joined the board within the last 15 years. So, we aren�� talking about a lot of tumult at the top.

  In fact, profitable net-nets seem to be especially common candidates for abandoning the responsibilities of a public company without actually getting taken private.

  OPT-Sciences

  This

Top 10 Semiconductor Stocks To Invest In 2014: NextStage Inc (NXT)

NextStage, Inc. is a holding company. The Company is engaged in the management of its investments in shares of stocks of its subsidiaries. The Company�� subsidiaries include Mondex Philippines Inc. (MXP), Infinit-e Asia Inc. (Infinit-e Asia) and Technology Support Services, Inc. (TSSI). MXP operates a multi-application smart card system in Philippines. Infinit-e Asia is a software development company specializing on smart card and e-commerce solutions tailored to enhance the business of its clients. Infinit-e Asia develops smart card solutions for both real and online applications and on both contact and contactless platform. Infinit-e Asia�� spectrum of products and applications are classified as payments, data capture and security. TSSI is engaged in the business of business process outsourcing (BPO), applications service providers (ASP) and managed service providers (MSP). Advisors' Opinion:

• [By Namitha Jagadeesh]

  HSBC Holdings Plc (HSBA), Europe�� largest bank, slid 2.1 percent. International Consolidated Airlines Group SA (IAG) declined 2 percent as it canceled some of its flights following a disruption caused by one of its planes at Heathrow airport. Next Plc (NXT) retreated 2.4 percent as Morgan Stanley cut its recommendation on the shares.